Functional Adhesives Film adhesives
We offer adhesives in film form. They ensure a uniform thickness of the adhesive layer, eliminate the application or drying process on site, as well as simplify the production of various composite films through laminate processing.
- Product name
- ARON MELT, etc.
- Information technology
- Electronics materials Computers Mobile information terminals
- Home electronics
- Televisions and DVDs Lighting equipment
- Environment and energy
- Reduce environmental impact
- Automobiles
- Automobile interior Automobile exterior
- Lifestyle
- Interior and exterior Daily sundries Toiletries Printing materials Packaging materials
Features
Features of hot melt adhesive films
ARON MELT PES Series
ARON MELT PES is a series of thermoplastic polyester adhesives. The series offers superior adhesion to resins such as PET, PC, and PVC as well as metals such as copper and aluminum. Due to their excellent solvent resistance and electrical characteristics, these products can be used in laminate adhesives for FFC and IC cards, as well as in sealant materials.
- 1Excellent adhesion to resins and metals, including PET, PC, ABS and PVC.
- 2Excellent electrical characteristics including voltage resistance and high insulation characteristics.
- 3The crystalline type of this line exhibits outstanding solvent resistance.
ARON MELT PPET Series (Developed products)
ARON MELT PPET-1200 is a series of heat resistant, hot melt adhesives developed for the lamination and bonding of different materials, such as metal with plastic. Products are available as pellets and films.
- 1Excellent adhesion to plastics including, PP, PE and PET, as well as metals such as aluminum and copper.
- 2Features low hygroscopicity and excellent chemical resistance to acids, alkalis and alcohols.
- 3As a hot melt adhesive, it can achieve adhesion within a short time.
- 4Improves work environment as it uses zero organic solvent.
Features of low dielectric bonding film (developed product)
- 1Film type modified epoxy adhesive
- 2Excellent dielectric properties (Dk = 2.2, Df = 0.002)
- 3Excellent adhesion to substrates such as polyimide, LCP, and copper foil
- 4Excellent solder dip resistance
Usage
Hot melt adhesive film PES Series
Excellent adhesion to resins such as PET, polycarbonate and vinyl chloride, and metals such as copper and aluminum. Can be used in laminate adhesives for FFC and IC cards, as well as in sealant materials.
Hot melt adhesive film PPET Series
Excellent adhesion to plastics such as PP, PE and PET and metals such as copper and aluminum. Can be applied to laminating and bonding different types of material.
Low dielectric bonding film
Exhibits excellent adhesiveness to substrates such as polyimide, LCP (liquid crystal polymer), and copper foil. It has excellent dielectric properties and can suppress signal loss in large volume high-speed communication.
