Inorganic Functional Materials (Environmental Amenity and Electronic Materials) Inorganic ion capture agent IXE
Conventional organic ion exchange resins have the weaknesses of low heat resistance and poor resistance to organic solvents. Also, clay minerals and zeolite have been known as inorganic ion exchangers for long time. However, they have some weaknesses likepoor reproducibility of functions and lack of water resistance. IXE is a series of inorganic ion exchangers commercialized for the first time in the world by Toagosei to offset the weaknesses of conventional organic and inorganic ion exchangers.
- Information technology
- Electronic materials Computers Mobile information terminals Others
- Home electronics
- Televisions and DVD Lighting equipment
- Environment and energy
- Recycling Reduce environmental impact Others
- Basic materials
- Resin and rubber additives Paint, ink, coatings and adhesives Others
- Lifestyle
- Printing materials Packaging materials
Features
IXE is an ion-trapping agent with superior ion-trapping and heat resistance properties. The reliability of electronic materials can be improved by adding this agent to sealants or other materials.
- Superior heat resistance.
- High ion selectivity; specific ions can be trapped through co-existing ions.
- Effective even in conditions with almost no moisture.
- High resistance to radiation means no deterioration even under strong radiation.
- Superior resistance to organic chemicals and to melting resins.
- High resistance to oxidation, meaning it can be used in oxidized environments.
Mechanism of action
The reliability of electronic materials can be improved by adding this agent to trap the ions of impurities in sealants.
Usage
- IC encapsulating material (EMC, liquid sealing material, and more)
- FPC adhesives and resist Inks
- Paints (coating film durability, improvement of rust resistance effects)
- Organic solvents, purification of monomers, etc.
Specifications
Suppression of migration of copper wiring
- Effectively suppresses copper wiring migration.
Copper wiring migration test
Test conditions
- Epoxy acrylate + urethane acrylate resin 98 parts, IXE-770D 2.0 parts
- Wiring width 50 µm, wiring spacing 50 µm
- Moisture resistance load test (85℃, 85% RH, 50V, 500 hours)
*9:00 am - 5:00 pm (except weekends and holidays)