Toagosei Annual R&D Report “TREND” – Issue No. 13

As the mounting density on circuit boards increases due to miniaturization, weight reduction, and sophistication of electronic devices, the distance between conductors (electrode spacing) is becoming smaller1). This makes it easier for insulation defects to occur due to factors such as moisture and dust. Therefore, insulating coating agents such as acrylic resin and silicone resin are applied on the circuit board to improve insulation reliability.

For example, in the case of large-screen flat-panel TVs, insulating coating agents are used at the interface between the Flat Panel Display (FPD) panel and the Flexible Printed Circuit (FPC) (Figure 1)2).