Toagosei Annual R&D Report “TREND” – Issue No. 8

In recent years, IC cards have been used in various sectors, as exemplified by IC phone cards, JR East’s SUICA 1) train ticket, and IC credit cards. Contactless IC cards, which utilize electromagnetic induction to communicate data between IC cards and readers or writers, are increasing, particularly in the transportation sector, where high-speed processing is required, as well as in the distribution sector, where operational ease and expeditious payment are expected. Figure 1 shows the structure of a contactless IC card. In this structure, an adhesive bonds a circuit board layer with an IC chip and an antenna coil on top of it, and a surface layer substrate material. Polyvinyl chloride (PVC) was traditionally used as the substrate for cards. However, due to environmental concerns, it has been replaced by a resin material called polyethylene terephthalate (PET) or PETG, which is a copolymer of PET and 1,4-Cyclohexanedimethanol. Adhesive materials are required to have adhesion to these substrates and the ability to fill in the irregularities on the IC chip surface, while also maintaining the properties of the card.

Toagosei has released ARON MELT PES, a copolyester hot melt adhesive, with the following characteristics:

(1) Excellent adhesion: Excellent adhesion to plastic materials, such as PET, PVC, and polycarbonate (PC), as well as metal materials, such as aluminum, copper, and iron.

(2) Excellent physical properties: Cohesive, sturdy, and flexible resin.

(3) Excellent electrical properties: Excellent insulation resistance and dielectric strength.

(4) Good workability: Availability in various forms, such as pellets, films, and solutions.

(5) Safety: Environmentally friendly, solvent-free, hot-melt type.